Pac Tech's Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility. These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization (UBM), tall Ni/Au for ACF and ACA bumping, and Ni/Au and Ni/Pd/Au for pad re-metallization (wirebonding). Pac Tech offers plating services on both Aluminum and Copper based integrated circuits, as well as plating on 100, 150, 200, and 300mm wafers. The process versatility also allows plating on Si, GaAs, InP, and LiTaO3 substrates.
Pac Tech offers several technologies for solder deposition including: single sphere jetting using Pac Tech's SB² Laser Based Bumping tools, and whole wafer bumping using Pac Tech's Ultra-SB² Solder Sphere Transfer equipment; in addition to traditional solder paste printing. The combination of these technologies allows Pac Tech to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medial, Aerospace, Consumer, Memory, MEMS, Probe Card, and Disc Drive industries.
To facilitate being a full service provider, Pac Tech offers a complete set of additional wafer level and backend services, including: sawing, dicing, redistribution, repassivation, backside laser marking, backside coating, test die, and assembly.
In addition, Pac Tech has the latest in metrology and analytical equipment to help in the development and production processes, including: x-ray, shear, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc...
|
Pac Tech provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend industries. This equipment is divided into three separate platforms: e-Ni/Au Plating, Solder Bumping, and Backend Assembly.
The cornerstone to Pac Tech's equipment offering is the fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300). This sytem allows for processing 100-300mm wafer with Ni, Pd, and Au at volumes of over 600,000 parts per year. In addition, Pac Tech offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (SpinPac), megasonic solvent cleaning (MegaPac).
Pac Tech offers two different equipment platforms for depositing solder on top of the e-Ni/Au UBM. These include the Laser Assisted Solder Jetting (SB²) tools and the Solder Sphere Transfer (Ultra-SB²) tools. The laser based tool is ideal for prototyping and low volume bumping applications like MEMS, Military, and Medical, but also for special bumping applications like: single die, probe cards, substrates, and disc drive heads. The solder transfer tool is ideal for high yield and high volume bumping applications.
To facilitate a full turn key solution to their equipment line, Pac Tech offers a full set of additional equipment for Wafer Level Packaging and Backend applications, including: laser based assembly tools LAPLACE™ FC and WLP, Automated Optical Inspection (AOI HS³) and Laser Marking (LS²).
|
