Pac Tech Packaging Technologies is a worldwide leader in both Wafer Level Manufacturing Services and in Wafer Level Packaging Equipment.  Pac Tech has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia.  These sites can supply both engineering and  prototyping services, as well as high volume production.  Pac Tech is structured to provide a single source for all contract Bumping Services, as well as providing turn key Wafer Level Packaging Equipment.

The core technologies that Pac Tech offers are centered around Electroless Nickel/Gold Bumping and Laser Based Solder Deposition (services and equipment).
Pac Tech's philosophy is to integrate its leading technology developments into high quality equipment for high volume production.

Contract Manufacturing Services
Electroless NiAu, Solder, & Backend

Equipment
Wafer Level Bumping & Back-End

Pac Tech's Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility.  These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization, tall Ni/Au for ACF and ACA bumping, and  Ni/Au and Ni/Pd/Au for pad re-metallization (wirebonding).  Pac Tech offers plating services on both Aluminum and Copper based integrated circuits, as well as plating on 100, 150, 200, and 300mm wafers.  The process versatility also allows plating on Si, GaAs, InP, and LiTaO3 substrates.

Pac Tech offers several technologies for solder deposition including: single sphere jetting using Pac Tech's SB² Laser Based Bumping tools, and whole wafer bumping using Pac Tech's Ultra-SB² Solder Sphere Transfer equipment; in addition to traditional solder paste printing.  The combination of these technologies allows Pac Tech to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medial, Aerospace, Consumer, Memory, MEMS, Probe Card, and Disc Drive industries.

To facilitate being a full service provider, Pac Tech offers a complete set of additional wafer level and backend services, including: saw, dice, redistribution, repassivation, backside laser mark, backside coating, test die, and assembly.

In addition, Pac Tech has the latest in metrology and analytical equipment to help in the development and production processes, including: x-ray, shear, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc...

Pac Tech provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.  This equipment is divided into three separate platforms: e-Ni/Au Plating, Solder Bumping, and Backend Assembly.

The cornerstone to PacTech's equipment offering is the fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300).  This sytem allows for processing 100-300mm wafers with Ni, Pd, and Au at volumes of over 600,000 parts per year.   In addition, Pac Tech offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (SpinPac), megasonic solvent cleaning (MegaPac).

Pac Tech offers two different equipment platforms for depositing solder on top of the e-Ni/Au UBM.  These include the Laser Assisted Solder Jetting (SB²) tools  and the Solder Sphere Transfer (UltraSB²) tools. The laser based tool is ideal for prototyping and low volume bumping applications like MEMS, Military, and Medical; but also for special bumping applications like: single die, probe cards, substrates, and disc drive heads. The Solder Transfer tool is ideal for high yield and high volume bumping applications.

To facilitate a full turn key solution to their equipment line, Pac Tech offers a full set of additional equipment for Wafer Level Packaging and Backend applications, including: laser based assembly tools LAPLACE™ FC and WLP, Automated Optical Inspection (AOI HS³) and Laser Marking (LS²).