Pac Tech is the worldwide leading supplier in Electroless Wafer Bumping technologies. With volume production facilities in Germany, USA, and Japan; Pac Tech offers a capacity of over 760,000 wafers per year in 6”, 8”, and 12”. Pac Tech provides turnkey Wafer Bumping and Wafer Level Packaging solutions. This includes engineering, development of prototypes, and high volume production. Pac Tech offers following technologies for Wafer Level Packaging: Wafer Bumping (Flip Chip & WLCSP):E-less Ni/Au Bumping (4, 5, 6, 8, & 12 inch wafers) E-less Ni/Au² or Ni/Pd/Au for TS Wirebonding Aluminum and Copper Pad Metallization Wafer Level Printing (eut.SnPb, SnAgCu) Micro Solder Ball Attach Solder Ball SB2-Jet (eut.SnPb, SnAgCu, AuSn, InSn) Wafer Level RDL with BCB Repassivation Backend Processing & Assembly:
Wafer Thinning & Dicing, Backside Laser Marking Die Singulation & Reel Packaging, Flip Chip Assembly | Pac Tech's philosophy is to integrate its leading technology developments into volume production equipment.
Pac Tech provides three equipment platforms: Electroless Plating and Peripheral Equipment:
PACLINE 300, PlasPac, SpinPac,
V-Pac, MegaPac
Laser Assisted Solder Jetting and Die/Wafer Level Attach for Flip Chip and MEMS Packaging:
SB² Jet, LAPLACE-FC, LAPLACE-WLP, Laser Marking LS²
Wafer Level µSolder Ball Attach, Ball Inspectionand Ball Rework:
ultra SB², Bump AOI HS³ |
