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 General Company Information

 Wafer Level Bumping & Packaging

 Advanced Packaging Equipment
 PAC TECH Company Profile
 
 
 
 
 
 
 
 
 
 
 
 		  Wafer Bumping Brochure  SB2-Jet, SB2-SM, SB2-M
 Backend Services  Ultra-SB2 200/300
 Design Rules  Ultra-SB2 300 WLR
 Test Chip 2.0  PacLine 200/300 A50
 Test Chip 2.1  SpinPac ASC 200/300
 Test Chip 2.3  PlasPac 200
 Test Chip 2.5  PlasPac 300 & MegaPac 300 plus
 Test Chip 2.6  LAPLACE-FC
 Flip Chip Testkit Pac 2.0  LAPLACE-Cap-SB2
 SB2 for Specialty Substrates  LS2-SM & LS2-300
   Reflow Oven RF 200/300

Effective: 08.2010