Specifications:

•  Wafer size: 8" - 12"

•  Solder ball size: 50µm - 760µm

•  25 wafers/ hour 12 inch

•  30 wafers/ hour8 inch

•  automatic wafer inspection

•  removal of misplaced balls

•  flux dispensing

•  replacement of missing balls

•  update of electronic wafer map

•  ultra fast post ball inspection