Contract Manufacturing Services Electroless Ni/Au   Solder Bumping Backend Processing

PAC TECH's Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility.  These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization, tall Ni/Au for ACF and ACA bumping, and  Ni/Au and Ni/Pd/Au for pad re-metallization (wirebonding). 
PAC TECH offers plating services on both Aluminum and Copper based integrated circuits, as well as plating on 100, 150, 200, and 300mm wafer.  The process versatility also allows plating on Si, GaAs, InP, and LiTaO3 substrates.

PAC TECH offers several technologies for solder deposition including: single sphere jetting using PAC TECH's SB² Laser Based Bumping tools, and whole wafer bumping using PAC TECH's Ultra-SB² Solder Sphere Transfer equipment; in addition to traditional solder paste printing. The combination of these technologies allows PAC TECH to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medial, Airospace, Consumer, Memory, MEMS, Probe Card, and Disc Drive industries.

To facilitate being a full service provider, PAC TECH offers a complete set of additional wafer level and backend services, including: sawing, dicing, redistribution, repassivation, backside laser marking, backside coating, test die, and assembly.

In addition, PAC TECH owns the latest metrology and analytical equipment to help in the development and production processes, including: x-ray, shear, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc...