Pac Tech - Flip Chip, WLCSP, Wafer Bumping, Wafer Level, Backend, Semiconductor, Packaging, Equipment, Solder

Top-Management-Team


Dr.-Ing. Elke Zakel President & CEO Pac Tech Group This e-mail address is being protected from spambots. You need JavaScript enabled to view it	Dipl.-Ing. Thomas Oppert Vice President Global Sales & Marketing This e-mail address is being protected from spambots. You need JavaScript enabled to view it	Dipl.-Ing. Ghassem Azdasht CTO Pac Tech Group This e-mail address is being protected from spambots. You need JavaScript enabled to view it	Dr. Thorsten Teutsch President & CTO Pac Tech USA Inc. This e-mail address is being protected from spambots. You need JavaScript enabled to view it
Phone: +49 (0)3321-4495-121 Mobile: +49 (0)173-984 97 01 Fax: +49 (0)3321-4495-124	Phone: +49 (0)3321-4495-620 Mobile: +49 (0)172-396 37 06 Fax: +49 (0)3321-4495-610	Phone: +49 (0)3321-4495-129 Mobile: +49 (0)173-871 29 19 Fax: +49 (0)3321-4495-124	Phone: +1 408-588-1925 ext. 202 Mobile: +1 408-667 89 46 Fax: +1 408-588-1927