|
MEGAPAC MP 300 - Megasonic Clean with QDR and Wafer Handling System:
The Megasonic system MP 300 is e.g. suited for cleaning of flux residues from wafers after wafer level solder paste printing and solder paste reflow.
The system can handle a maximum of one wafer carrier with 25 wafers 8” or 13 wafers 12". |
|
|
Specifications:
- Suitable for a Variety of Cleaning Processes:
e.g.: Solder Flux Cleaning
- Explosive Safe Construction
- Semi-Automatic PLC Control
- Additional QDR Rinse Tank
- Maximum Flexibility: 4”, 5”, 6”, 8”, 12”
- Size: 1200 x 800 x 1810 mm (D x W x H)
- Basin size: 370 x 370 mm
- AC 400 V, 50 Hz / 25 A / 5 kW
- Frequency: 1 MHz
- Heating power: 3 kW
- Circulation-Filtration: 15 l/min
|
|
