Backend & Assembly Services


In addition to the foundry services for Wafer Bumping Pac Tech:
 
 

 1.) supplies chemicals and materials for the equipment it sells

  Chemical and Materials  
     

 2.) provides onsite service and repairs

  Service and Repairs  
     

 3.) provides test wafers and boards

 Test Boards

 Test Wafers
     

 4.) provides analytical services

Analytical Services

 
     

 5.) provides Flip Chip assembly services

 Pac Tech offers the assembly of Flip Chips for prototyping and small volumes
 in cooperation with Smart Pac GmbH - Technology Services.

 These services include Laser-based assembly using the LAPLACE equipment.

 In addition Pac Tech offers following services:
  • Laser Marking
  • Wafer Thinning
  • Wafer Dicing
  • Wafer Level RDL
  • Tape & Reel
 
 		 Smart Card Module
Smart Card Module		 [Keine Beschreibung eingegeben]
Consumer product with Flip Chip