Automatic Ultra-SB² 300
         

Semiautomatic Ultra-SB² 200 

Specifications:

•  60µm-760µm solder spheres

•  150µm-1mm pad pitches

•  Yield: > 250µm balls: > 99.99 %

•  Yield: < 200µm balls: > 99.98 %

•  Solder bump height coplanarity: < 10 µm @ 3sigma

•  SnPb37 or Lead-free SnAgCu

•  High throughput: 30 wafers/h incl. 2x inspection & repair

•  Wafer sizes: 4 – 12 inch

•  Robot Handling from cassette to cassette (optional)

•  Low tooling cost

•  Volume production & prototyping capability

•  Integrated rework capability (opt.)

•  2-D Inspection (optional)